Enflex at PACK EXPO Las Vegas 2025: Discover Smart, Sustainable Pouching

• PACK EXPO Las Vegas | West Hall, Coesia booth W-1064 
• Complimentary registration with our exclusive code 
• Live demonstration of the Enflex F-17 DX flat pouching machine 

Join Enflex at PACK EXPO Las Vegas 2025 and explore the future of flat pouch packaging at the Coesia booth W-1064. This is your chance to see how Enflex combines performance, precision, and sustainability in a compact footprint. 

See the Enflex F-17 DX in Action

Discover the Enflex F-17 DX, a compact horizontal form-fill-seal (HFFS) machine tailored for healthcare and personal care applications. Designed to form, fill, and seal flat pouches from a single reel of flexible packaging material, the F-17 DX offers:

• Simplex or duplex operation for flexible production speeds 
• Compatibility with printers, cameras, and labelers 
• Support for 100% recyclable packaging materials 
• Easy size changeovers via intuitive HMI and numeric counters 

With its smart design and scalable performance, the F-17 DX brings reliability and sustainability to every pouch.

Meet the Experts, Explore Coesia Technologies

Join our team of experts and discover how Enflex and the broader Coesia portfolio can help you optimize production, reduce waste, and meet your market’s growing demands.

Don’t miss demonstrations from our sister companies including FlexLink, Hapa, MGS, ACMA, Citus Kalix, G.D, NORDEN, VOLPAK, AMACO, and PWR, a Coesia partner. Plus, visit our dedicated service area to learn more about our digitally enhanced customer service solutions.

Meet us at PACK EXPO Las Vegas 2025, 29 September – 1 October 
Las Vegas Convention Center, Las Vegas, Nevada
West Hall, Booth W-1064